OPK is organizing the first production of 3D microsystems in Russia
The Moscow Radiotechnical Institute of the Russian Academy of Sciences, part of the United Instrument-Making Corporation, is building the Experimental-Technological Center for the creation of high-density electronics of the new generation - compact 3D microsystems. The project is implemented within the framework of the Federal Target Program “Development of the electronic component base and radio electronics for 2008-2015 years”.“This is a new experimental production complex for the development, testing and preparation for serial production of 3D microsystems,” said Alexander Yakunin, General Director of United Instrument Engineering Corporation, “At the moment there is no mass production of such microsystems in Russia, their developments are experimental. Russian manufacturers of equipment work with Western products or domestic chips, which are often inferior to foreign manufacturers in reliability, size and speed. In this sense, the project can be called a breakthrough for domestic radio electronics. ”
“The 3D microsystem is the newest type of electronic modules for modern electronic equipment,” said Mikhail Khokhlov, general director of MRTI RAS. - It includes microcircuits, elements of connections and connections, made using packageless element base. The main advantages of 3D microsystems compared to electronic equipment nodes made on the basis of traditional technology are a significant reduction in the size of electronic equipment (4-8 times), as well as increased productivity, reduced power consumption, improved reliability. "
Advantages are achieved due to the exclusion from the design of cases in which chips of semiconductor devices and large integrated circuits are placed, physical and electrical convergence of crystals. In such microsystems, brazed and welded joints are eliminated, reducing the reliability of assemblies and blocks. Group processing methods are used, carried out in “clean room” conditions or in a vacuum environment, which also increases reliability. This approach allows you to integrate into a single micro system dissimilar chips made by different technologies.
“With the help of new technologies, compact high-precision devices can be created both in the defense and space industries and in the civilian sphere,” says Alexander Yakunin. “3D microsystems can be used, for example, in information technology, mobile communications, the production of medical equipment, that is , wherever standard PCB chips are being used now. ”
Compact microsystems are necessary for the creation of modern receiving-transmitting modules, digital processing units, monitoring systems, automated control and communication systems in industry, utilities and other industries. They are also used in the manufacture of unmanned aerial vehicles, various ground-based, mobile, airborne and space-based radars.
“At present, construction and installation work is underway, equipment is being purchased, personnel are being hired and recruited,” Mikhail Khokhlov said. “In parallel, new production technologies are being worked out.”
The Experimental Technology Center MRTI RAS will begin operation in December 2014. During 2015, it is planned to conduct final testing and certification of pilot production technology at its base. Serial production of 3D microsystems should be launched at the factory of high density radio-electronic modules of the new generation in Tomsk by 2016 year.
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